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Conference proceeding would be published 
						by Materials Science Forum (MSF). ISBN: 978-3-0357-1637-5 Vol. 1060
						Online:
						
						https://www.scientific.net/MSF.1060
						Index: 
						SCOPUS
This year, the conference invite three keynote speakers and three invite speakers. They are
| Keynote Speech I  Prof. Zhongfan Liu, Peking University, China Mass Production Technology of CVD Graphene Materials for Setting the Cornerstone of Graphene Industry | Keynote Speech II  Prof. Alan Lau, Swinburne University of Technology, Australia Aircraft Composite Repair - Fundamental to Structural Health Monitoring | 
| Keynote Speech III  Prof. Jong Hak Kim, Yonsei University, South Korea Graft Copolymer for Membranes and Supercapacitors | Invite Speech I  Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore Mechanical metamaterials with sign toggling properties | 
| Invite Speech II  Dr. Seok-Keun Koh, DaeMyung TS, South Korea Antimicrobial Nanocomposites by the Nanoparticles on Powder (NPP) Process and its Current Status | Invite Speech III  Dr. Qiaoyuan Deng, Hainan University, China Cu Ion Promote the Formation of Carbonaceous Films on the Articulating Surface of Artificial Joints | 
R1004
						Paper Title: Characterization 
						of interfacial bonding properties of Vitrimer epoxy/ 
						T700 carbon fiber by 
						microdrop test
						Heshan Bai, Tianyu Zhao, Ruixiang Bai, 
						Zhenkun Lei, Chen Liu
						Dalian University of Technology, China
R1028
						Paper Title: Effective medium analysis of stacked-nanoparticles 
						array’s optical responses
						Muhammad Tegar Pambudi, Priastuti 
						Wulandari, Alexander A. Iskandar
						ITB, Indonesia
R1018-A
						Paper Title: Simultaneously 
						enhancing strength and ductility in graphene 
						nanoplatelets
						reinforced Ti6Al4V composites via selective laser 
						melting of core-shell powders
						Weijia Ren, Mabao Liu, Wei Zhang
						Xi’an Jiaotong University, China
R1004
						Paper Title: Characterization 
						of interfacial bonding properties of Vitrimer epoxy/ 
						T700 carbon fiber by 
						microdrop test
						Heshan Bai, Tianyu Zhao, Ruixiang Bai, 
						Zhenkun Lei, Chen Liu
						Dalian University of Technology, China
More and original, please mail icamr@sciei.org.